Touch panel and fabricating method thereof

ABSTRACT

A touch panel includes a cover plate, a first adhesive component, and a second adhesive component. The first adhesive component which is adhered underneath the cover plate, includes a plurality of first pattered sensing lines. The second adhesive component which is adhered underneath the first adhesive component, includes a plurality of second pattered sensing lines. The first pattered sensing lines and second pattered sensing lines are electrically insulated from each other.

RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/206,316, filed on Jul. 11, 2016, which claims priority to ChinesePatent Application Serial Number 201510425408.8, filed in the People'sRepublic of China on Jul. 11, 2015. U.S. patent application Ser. No.15/206,316 and Chinese Patent Application Serial Number 201510425408.8are herein incorporated by reference.

BACKGROUND Field of the Disclosure

The present disclosure relates to touch technology. More particularly,the present disclosure relates to a touch panel and a fabricating methodthereof.

Description of the Related Art

Currently, touch panels are extensively applied to portable electronicdevices, such as teller machines, mobile phones, cameras, game consoles,tablet computers and so on, to achieve friendly and intuitivehuman-computer interaction and increase convenience of use.

At present, many capacitive touch panels use a laminated structure. Asuperficial substrate is usually a glass cover plate made of glassmaterial. The glass cover plate is mainly used to protect underlyingtouch components and lower substrates are mainly used for support.Sensing lines which are used to detect variation of signals caused byfinger or stylus are formed over the lower substrates, and an externalcontroller detects the touched position according to the variation ofthe signals. Among current techniques, an adhesive layer is necessarybetween the lower substrate and other stacked structure, whereby thesecomponents are combined into a touch panel. However, in order to fulfilla requirement of load bearing, the lower bearing substrates must have acertain thickness. However, when the number of the bearing substratesincreases, the total thickness of the touch panel is thickenedaccordingly. Therefore, research continues on how to reduce thethickness of the touch panel. Accordingly, a new touch panel andfabricating method thereof are needed.

SUMMARY

The present disclosure provides a touch panel with a plurality ofsensing lines directly forming on an adhesive bearing layer. Because theadhesive bearing layer can directly adhere to other layers, additionaladhesive layer is unnecessary. Therefore, the process steps can bereduced. The stickiness of the adhesive bearing layer make the sensinglines adhere to the adhesive bearing layer better to avoid the sensinglines detaching during fabrication.

An aspect of the instant disclosure is a touch panel. The touch panelincludes a cover plate; a first adhesive component adhered underneaththe cover plate and including a plurality of first patterned sensinglines; and a second adhesive component adhered underneath the firstadhesive component and including a plurality of second patterned sensinglines, wherein the first patterned sensing lines and second patternedsensing lines are electrically insulated from each other.

In accordance with some embodiments of the present disclosure, a touchpanel includes a cover plate; and an adhesive component adheredunderneath the cover plate wherein the adhesive component includes aplurality of first patterned sensing lines; and a plurality of secondpatterned sensing lines wherein the first patterned sensing lines andthe second patterned sensing lines are electrically insulated form andintersected with each other in a same layer.

Another aspect of the instant disclosure is a method of fabricating atouch panel. The method includes providing a cover plate; adhering afirst adhesive component underneath the cover plate and the firstadhesive component including a plurality of first patterned sensinglines; and adhering a second adhesive component underneath the firstadhesive component and the second adhesive component including aplurality of second patterned sensing lines wherein the first patternedsensing lines and second patterned sensing lines are electricallyinsulated from each other.

Another aspect of the present disclosure is a method of fabricating atouch panel. The method includes providing a cover plate; and adheringan adhesive component underneath the cover plate wherein the adhesivecomponent includes a plurality of first patterned sensing lines; and aplurality of second patterned sensing lines wherein the first patternedsensing lines and the second patterned sensing lines are electricallyinsulated from and intersected with each other in a same layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a touch device according to some embodiments of the instantdisclosure;

FIGS. 2A-3B show schematic diagrams and cross-section views of afabrication method for coating a conducting layer over an adhesivebearing layer according to some embodiments of the instant disclosure;

FIG. 4A shows a touch device according to some embodiments of theinstant disclosure;

FIG. 4B shows a schematic diagram of the touch panel in FIG. 4A;

FIG. 5A shows a touch device according to some embodiments of theinstant disclosure;

FIG. 5B shows a schematic diagram of the touch panel in FIG. 5A;

FIG. 6A shows a touch device according to some embodiments of theinstant disclosure;

FIG. 6B shows a schematic diagram of the touch panel in FIG. 6A;

FIG. 7A shows a touch device according to some embodiments of theinstant disclosure;

FIG. 7B shows a schematic diagram of the touch panel in FIG. 7A;

FIG. 8 shows a top view of the first patterned sensing lines and secondpatterned sensing lines in FIG. 7B according to some embodiments of theinstant disclosure.

FIG. 9A shows a touch device according to some embodiments of instantdisclosure; and

FIG. 9B shows a schematic diagram of the touch panel in FIG. 9A.

DETAILED DESCRIPTION

Reference will now be made in detail to the present embodiments of thedisclosure, examples of which are illustrated in the accompanyingdrawings. Wherever possible, the same reference numbers are used in thedrawings and the description to refer to the same or like parts.

As shown in FIG. 1, FIG. 1 shows a touch device 100 according to someembodiments of the instant disclosure. The touch device 100 includes acover plate 120, a first adhesive component 130, a second adhesivecomponent 140, an adhesive layer 150, and a display panel 160. The firstadhesive component 130 is adhered underneath the cover plate 120 andincludes a plurality of first patterned sensing lines (not shown). Thesecond adhesive component 140 is adhered underneath the first adhesivecomponent 130 and includes a plurality of second patterned sensing lines(not shown). The first patterned sensing lines and second patternedsensing lines are electrically insulated from each other.

According to some embodiments of the instant disclosure, the firstadhesive component 130 further includes a first adhesive bearing layer(not shown). The first patterned sensing lines are directly formed onthe first adhesive bearing layer and the first patterned sensing linesare adhered to the cover plate 120 by the first adhesive bearing layer.The second adhesive component 140 further includes a second adhesivebearing layer (not shown). The second patterned sensing lines aredirectly formed on the second adhesive bearing layer and the secondpatterned sensing lines are adhered to the first adhesive component 130by the second adhesive bearing layer. A touch panel 170 includes thecover plate 120, the first adhesive component 130, and the secondadhesive component 140. According to some embodiments of the instantdisclosure, the touch panel 170 is adhered to the display panel 160 bythe adhesive layer 150. Referring to FIGS. 4A-6B, FIGS. 4A-6B showvarious embodiments and fabrication methods of structure of the touchdevice.

According to some embodiments of the instant disclosure, the cover plate120 may be some transparent materials and includes but not limited torigid cover plate or flexible cover plate. For example, a material ofthe cover plate is glass, polycarbonate (PC), polyethylene terephthalate(PET), polymethylmesacrylate, (PMMA), poly vinyl chloride (PVC),polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA),polyethylene (PE), polysulfone (PSU), cyclic olefin copolymer (COC),etc.

According to some embodiments of the instant disclosure, the adhesivebearing layer (first adhesive bearing layer or second adhesive bearinglayer) has a top surface and a lower surface opposite to the topsurface. Both the top surface and the lower surface are adhesive andeach surface has a release film (not shown). If the top surface or thelower surface need adhere to other components, the release films areremoved, such that the top surface or the lower surface can adhere toother components. A material of the adhesive bearing layer (firstadhesive bearing layer or second adhesive bearing layer) may beoptically clear adhesive (OCA) or optically clear resin (OCR) andincludes but is not limited to unsaturated polyester adhesive, siliconerubber adhesive, acrylic resin adhesive, polyurethane adhesive, epoxyresin adhesive or a combination thereof.

According to some embodiments of the instant disclosure, the displaypanel 160 includes but is not limited to a liquid crystal module.Components of the display panel 160 include but are not limited to acontroller or a circuit board.

FIGS. 2A-3B show schematic diagrams of a fabrication method andcross-section views for coating a conducting layer 300 over an adhesivebearing layer 200 (first adhesive bearing layer or second adhesivebearing layer) to form a plurality of patterned sensing lines (firstpatterned sensing lines or second patterned sensing lines) according tosome embodiments of the instant disclosure. As shown in FIG. 2A, theadhesive bearing layer 200 is provided. FIG. 2B is a cross-section viewalong a section line I-I′ of FIG. 2A. In FIG. 2A and FIG. 2B, each of atop surface and a lower surface of the adhesive bearing layer 200 has arelease film (not shown). Before the conducting layer 300 is coated overthe top surface of the adhesive bearing layer 200, the release film ofthe top surface of the adhesive bearing layer 200 is removed, therebythe conducting layer 300 is directly coated over the top surface of theadhesive bearing layer 200 with stickiness.

FIG. 3B is a cross-section view along a section line II-II′ of FIG. 3A.As shown in FIG. 3A and FIG. 3B, the conducting layer 300 is coated overthe top surface of the adhesive bearing layer 200. According to someembodiments of the instant disclosure, the coating is by sputtering,electroplating, printing, spin coating, wet coating, or other methods.Compared to traditional techniques in which a conducting layer isdirectly formed on a bearing substrate, which usually induces problemssuch as low adhesive force between the conducting layer and the bearingsubstrate, the instant disclosure utilizes the feature that the surfaceof the adhesive bearing layer is sticky to coat directly the conductinglayer 300 over the surface of the adhesive bearing layer 200. Anadhesion force between the conducting layer 300 and the adhesive bearinglayer 200 is enhanced by the stickiness of the adhesive bearing layer200 to reduce a risk of detachment of the conducting layer 300.According to some embodiments of the instant disclosure, a material ofthe conducting layer 300 includes but is not limited to silver nanowire.

Subsequently, the conducting layer 300 is etched to form a plurality ofpatterned sensing lines (first patterned sensing lines or secondpatterned sensing lines). According to some embodiments of the instantdisclosure, after etching, one aspect of the patterned sensing lines mayrefer to a plurality of first patterned sensing lines 444 shown in FIG.4B. According to other embodiments of the instant disclosure, afteretching, one aspect of the patterned sensing lines may refer to abiaxially-oriented single-layer line formed by a plurality of firstpatterned sensing lines 744 and a plurality of second patterned sensinglines 748 shown in FIG. 8. The first patterned sensing lines 744 and thesecond patterned sensing lines 748 intersect each other in a same layerand are electrically insulated from each other.

According to some embodiments of the instant disclosure, the etching isperformed by any traditional etching process and includes but is notlimited to laser etching, chemical etching, plasma etching, orphotolithography.

FIG. 4A shows a touch device 400 according to some embodiments of theinstant disclosure. FIG. 4B shows a schematic diagram of a touch panel440 in FIG. 4A. The touch device 400 includes the touch panel 440, anadhesive layer 450, and a display panel 460. The touch panel 440includes a cover plate 420, a first adhesive bearing layer 442, a secondadhesive bearing layer 446, a plurality of first patterned sensing lines444 and a plurality of second patterned sensing lines 448. The firstpatterned sensing lines 444 are directly formed on the first adhesivebearing layer 442 such that a lower surface of the first patternedsensing lines 444 are in direct contact with the first adhesive bearinglayer 442. The second patterned sensing lines 448 are directly formed onthe second adhesive bearing layer 446 such that a lower surface of thesecond patterned sensing lines 448 are in direct contact with the secondadhesive bearing layer 446. According to some embodiments of the instantdisclosure, the adhesive layer 450 is between the touch panel 440 andthe display panel 460. A thickness of the adhesive layer 450 ranges from15 μm to 20 μm. According to some embodiments of the instant disclosure,the adhesive layer 450 is omitted such that the second adhesive bearinglayer 446 is directly adhered on the display panel 460.

According to some embodiments of the instant disclosure, the firstpatterned sensing lines 444 are directly formed on the first adhesivebearing layer 442. The first adhesive bearing layer 442 is used as abearing substrate of the first patterned sensing lines 444 and adheresto the first patterned sensing lines 444 to the cover plate 420. Thefirst patterned sensing lines 444 are easily scratched during subsequentfabrication. Further, when a material of the first patterned sensinglines 444 is a metal nanostructure (silver nanowire), the firstpatterned sensing lines 444 are easily oxidized by air to influence aconductivity of the first patterned sensing lines 444. Therefore, thefirst adhesive bearing layer 442 directly covering the first patternedsensing lines 444 can protect the first patterned sensing lines 444.Further, because the first patterned sensing lines 444 are formed on thefirst adhesive bearing layer 442 by laser or etching, a difference inetching step height exists between the region having the sensing linesand the region without the sensing lines over the first adhesive bearinglayer 442. If the first patterned sensing lines 444 are required to befully protected by the first adhesive bearing layer 442, the differencein etching step height should preferably be overcome, so that the firstadhesive bearing layer 442 can fully cover the first patterned sensinglines 444. Therefore, a thickness of the first adhesive bearing layer442 increases accordingly. The thickness of the first adhesive bearinglayer 442 ranges from 40 μm to 60 μm. The first adhesive bearing layer442 directly covers the second patterned sensing lines 448 such that atop surface of the second patterned sensing lines 448 is in directcontact with the first adhesive bearing layer 442. Therefore, the firstadhesive bearing layer 442 may protect the second patterned sensinglines 448 as well. Further, the second patterned sensing lines 448 areformed on the second adhesive bearing layer 446 by laser or etching.Therefore, in order to protect another exposed surface of the secondpatterned sensing lines 448, the second adhesive bearing layer 446 hasto overcome a difference in etching step height of the second patternedsensing lines 448, so as to fully cover the second patterned sensinglines 448. Accordingly, in some embodiments, a thickness of the secondadhesive bearing layer 446 ranges from 40 μm to 60 μm. Further, althoughFIG. 4A shows the area of the first adhesive bearing layer 442 is thesame as the area of the first patterned sensing lines 444, the area ofthe first adhesive bearing layer 442 is generally larger than the areaof the first patterned sensing lines 444 in actual fabrication. Morespecifically, the first patterned sensing lines 444 are practicallypositioned at a central region (corresponding to a visual region oftouch panel 440) of the first adhesive bearing layer 442. A peripheralregion (corresponding to a non-visible region of touch panel 440) of thefirst adhesive bearing layer 442 still remains a certain area to adherethe first patterned sensing lines 444 to the cover plate 420. Similarly,the area of the second adhesive bearing layer 446 is generally largerthan the area of the second patterned sensing lines 448. The secondpatterned sensing lines 448 are adhered to the first adhesive bearinglayer 442 by the stickiness between the first adhesive bearing layer 442and the second adhesive bearing layer 446.

Referring to FIG. 4B, a method for fabricating the touch panel 440 isprovided. The method includes at least the following steps. A firstadhesive bearing layer 442 is provided. A first conducting layer iscoated over the first adhesive bearing layer 442. The first conductinglayer is etched to form the first patterned sensing lines 444. A coverplate 420 is provided and the first patterned sensing lines 444 areadhered to the cover plate 420 by the first adhesive bearing layer 442.A second adhesive bearing layer 446 is provided. A second conductinglayer is coated over the second adhesive bearing layer 446 and thesecond conducting layer is etched to form a plurality of secondpatterned sensing lines 448 electrically insulated from the firstpatterned sensing lines 444. The second patterned sensing lines 448 areadhered to the first adhesive bearing layer 442 by the second adhesivebearing layer 446. The step of coating these conducting layers may referto the schematic diagrams of fabrication method and the cross-sectionviews for coating conducting layer over the adhesive bearing layer asshown in FIG. 2A to FIG. 3B.

As shown in FIG. 4B, the first patterned sensing lines 444 includeelectrodes arranged along the X axis and conducting lines connectingelectrodes. The second patterned sensing lines 448 include electrodesarranged along the Y axis and conducting lines connecting electrodes.The electrode shape of these patterned sensing lines is a rhombus,without limitation thereto. The electrode shape may be a square,rectangle, regular hexagon, or an irregular pattern with randomizedarrangement. According to some embodiments of the instant disclosure, amaterial of these patterned sensing lines includes but is not limited tosilver nanowire.

FIG. 5A shows a touch device 500 according to some embodiments of theinstant disclosure. FIG. 5B shows a schematic diagram of the touch panel540 in FIG. 5A. A touch device 500 includes a touch panel 540, anadhesive layer 550, and a display panel 560 wherein the touch panel 540includes a cover plate 520, a first adhesive bearing layer 542, a secondadhesive bearing layer 546, a plurality of first patterned sensing lines544 and a plurality of second patterned sensing lines 548. The firstpatterned sensing lines 544 are directly formed under the first adhesivebearing layer 542 such that a top surface of the first patterned sensinglines 544 are in direct contact with the first adhesive bearing layer542. The second patterned sensing lines 548 are directly formed underthe second adhesive bearing layer 546 such that a top surface of thesecond patterned sensing lines 548 are in direct contact with the secondadhesive bearing layer 546. The adhesive layer 550 is between the touchpanel 540 and the display panel 560 to adhere the touch panel 540 to thedisplay panel 560. In order to overcome a difference in etching stepheight of the second patterned sensing lines 548, the adhesive layer 550may fully cover the second patterned sensing lines 548. A thickness ofthe adhesive layer 550 ranges from 32 μm to 38 μm. According to someembodiments of the instant disclosure, the first patterned sensing lines544 are positioned under the first adhesive bearing layer 542. The firstadhesive bearing layer 542 is used as a bearing substrate of the firstpatterned sensing lines 544 and adheres the first patterned sensinglines 544 to the cover plate 520. In some embodiments, the firstadhesive bearing layer 542 does not cover the difference in etching stepheight of the first patterned sensing lines 544. Therefore, a thicknessof the first adhesive bearing layer 542 ranges from 25 μm to 30 μm. Whenthe first patterned sensing lines 544 are directly formed on the firstadhesive bearing layer 542 and is adhered to the cover plate 520, thefirst patterned sensing lines 544 are exposed to air during fabrication.The first patterned sensing lines 544 are easily scratched duringsubsequent fabrication. Further, when a material of the first patternedsensing lines 544 is a metal nanostructure (silver nanowire), the firstpatterned sensing lines 544 are easily oxidized by air to influence aconductivity of the first patterned sensing lines 544. Therefore, it isnecessary to add a protection layer under the first patterned sensinglines 544. In some embodiments, the second adhesive bearing layer 546 isused as a bearing substrate of the second patterned sensing lines 548and directly covers the first patterned sensing lines 544. Therefore,the second adhesive bearing layer 546 is used to protect the firstpatterned sensing lines 544, and cause the lower surface of the firstpatterned sensing lines 544 to be in direct contact with the secondadhesive bearing layer 546. Further, because the first patterned sensinglines 544 are formed on the first adhesive bearing layer 542 by laser oretching, a difference in etching step height exists between the regionhaving the sensing lines and the region without the sensing lines overthe first adhesive bearing layer 542. If the first patterned sensinglines 544 are required to be fully protected by the second adhesivebearing layer 546, the difference in etching step height should beovercome, so that the second adhesive bearing layer 546 fully covers thefirst patterned sensing lines 544. Therefore, a thickness of the secondadhesive bearing layer 546 increases. In at least one preferredembodiment, a thickness of the second adhesive bearing layer 546 rangesfrom 40 μm to 60 μm.

Referring to FIG. 5B, a method for fabricating the touch panel 540 isprovided. The method includes at least the following steps. A firstadhesive bearing layer 542 is provided. A first conducting layer iscoated under the first adhesive bearing layer 542. The first conductinglayer is etched to form the first patterned sensing lines 544. A coverplate 520 is provided and the first patterned sensing lines 544 isadhered to the cover plate 520 by the first adhesive bearing layer 542.A second adhesive bearing layer 546 is provided. A second conductinglayer is coated under the second adhesive bearing layer 546 and thesecond conducting layer is etched to form a plurality of secondpatterned sensing lines 548 electrically insulated from the firstpatterned sensing lines 544. The second patterned sensing lines 548 aredirectly adhered to the first patterned sensing lines 544 by the secondadhesive bearing layer 546. The step of coating these conducting layersmay refer to the schematic diagrams of fabrication method and thecross-section views for coating conducting layer over the adhesivebearing layer as shown in FIG. 2A to FIG. 3B.

The details of the first patterned sensing lines 544 and the secondpatterned sensing lines 548 refer to the descriptions of the firstpatterned sensing lines 444 and the second patterned sensing lines 448as shown in FIG. 4B.

FIG. 6A shows a touch device 600 according to some embodiments of theinstant disclosure. FIG. 6B shows a schematic diagram of a touch panel640 in FIG. 6A. The touch device 600 includes the touch panel 640, anadhesive layer 650, and a display panel 660. The touch panel 640includes a cover plate 620, a first adhesive bearing layer 642, a secondadhesive bearing layer 646, a plurality of first patterned sensing lines644 and a plurality of second patterned sensing lines 648. The firstpatterned sensing lines 644 are directly formed on the first adhesivebearing layer 642 such that a lower surface of the first patternedsensing lines 644 are in direct contact with the first adhesive bearinglayer 642. The second patterned sensing lines 648 are directly formedunder the second adhesive bearing layer 646 such that a top surface ofthe second patterned sensing lines 648 are in direct contact with thesecond adhesive bearing layer 646. Further, the second patterned sensinglines 648 are adhered to the first adhesive bearing layer 642 by thesecond adhesive bearing layer 646. In other words, the first patternedsensing lines 644 are adhered to the second adhesive bearing layer 646by the first adhesive bearing layer 642. According to some embodimentsof the instant disclosure, the adhesive layer 650 is between the touchpanel 640 and the display panel 660 to adhere the touch panel 640 to thedisplay panel 660. In order to overcome a difference in etching stepheight of the second patterned sensing lines 648, the adhesive layer 650may fully cover the second patterned sensing lines 648. A thickness ofthe adhesive layer 650 ranges from 32 μm to 38 μm. According to someembodiments of the instant disclosure, a material of the patternedsensing lines includes but is not limited to silver nanowires.

According to some embodiments of the instant disclosure, the firstpatterned sensing lines 644 are disposed over the first adhesive bearinglayer 642. The first adhesive bearing layer 642 is used as a bearingsubstrate of the first patterned sensing lines 644 and adheres the firstpatterned sensing lines 644 to the cover plate 620. In order to coverfully the first patterned sensing lines 644 and overcome a difference inetching step height of the first patterned sensing lines 644, athickness of the first adhesive bearing layer 642 increases accordingly.Thickness of the first adhesive bearing layer 642 ranges from 40 μm to60 μm. Further, the second adhesive bearing layer 646 is used as abearing substrate of the second patterned sensing lines 648 and adheresthe second patterned sensing lines 648 to the first adhesive bearinglayer 642. Therefore, the second adhesive bearing layer 646 isunnecessary to cover the difference in etching step height of the secondpatterned sensing lines 648. Accordingly, a thickness of the secondadhesive bearing layer 646 ranges from 25 μm to 30 μm.

Further, it is worth noting that although FIG. 6A shows the area of thefirst adhesive bearing layer 642 is the same as the area of the firstpatterned sensing lines 644, the area of the first adhesive bearinglayer 642 is generally larger than the area of the first patternedsensing lines 644 in actual fabrication. More specifically, the firstpatterned sensing lines 644 are practically positioned at a centralregion (corresponding to a visual region of touch panel 640) of thefirst adhesive bearing layer 642. A peripheral region (corresponding toa non-visible region of the touch panel 640) of the first adhesivebearing layer 642 still remains a certain area to adhere the firstpatterned sensing lines 644 to the cover plate 620.

Referring to FIG. 6B, a method for fabricating the touch panel 640 isprovided. The method includes at least the following steps. The firstadhesive bearing layer 642 is provided. A first conducting layer iscoated over the first adhesive bearing layer 642. The first conductinglayer is etched to form the first patterned sensing lines 644. The coverplate 620 is provided and the first patterned sensing lines 644 aredirectly adhered to the cover plate 620 by the first adhesive bearinglayer 642. A second adhesive bearing layer 646 is provided. A secondconducting layer is coated under the second adhesive bearing layer 646and the second conducting layer is etched to form a plurality of secondpatterned sensing lines 648 electrically insulated from the firstpatterned sensing lines 644. The second patterned sensing lines 648 aredirectly adhered to the first adhesive bearing layer 642 by the secondadhesive bearing layer 646. The step of coating these conducting layersmay refer to the schematic diagrams of fabrication method and thecross-section views for coating conducting layer over the adhesivebearing layer as shown in FIG. 2A to FIG. 3B.

The details of the first patterned sensing lines 644 and the secondpatterned sensing lines 648 refer to the descriptions of the firstpatterned sensing lines 444 and the second patterned sensing lines 448as shown in FIG. 4B.

FIG. 7A shows a touch device 700 according to some embodiments of theinstant disclosure. FIG. 7B shows a schematic diagram of a touch panel740 in FIG. 7A. The touch device 700 includes the touch panel 740, anadhesive layer 750, and a display panel 760. The touch panel 740includes a cover plate 720, an adhesive bearing layer 742, and patternedsensing lines 746. The patterned sensing lines 746 are directly formedunder the adhesive bearing layer 742 such that a top surface of thepatterned sensing lines 746 is in direct contact with the adhesivebearing layer 742. The patterned sensing lines 746 and the adhesivebearing layer 742 form an adhesive component. The adhesive layer 750 isbetween the touch panel 740 and the display panel 760 to adhere thetouch panel 740 to the display panel 760. In order to overcome adifference in etching step height of the patterned sensing lines 746,the adhesive layer 750 may fully cover the patterned sensing lines 746.A thickness of the adhesive layer 750 ranges from 32 μm to 38 μm.

According to some embodiments of the instant disclosure, the patternedsensing lines 746 includes a plurality of first patterned sensing lines744 and a plurality of second patterned sensing lines 748 intersectingeach other in a same layer. FIG. 8 shows a top view of the firstpatterned sensing lines 744 and second patterned sensing lines 748 ofFIG. 7B according to some embodiments of the instant disclosure. Thefirst patterned sensing lines 744 and second patterned sensing lines 748intersect and are biaxially oriented. The first patterned sensing lines744 include a plurality of first conducting lines 7440, a plurality ofelectrodes 7442 arranged along the X axis and a plurality of electricbridges 7444 connecting the electrodes 7442. The second patternedsensing lines 748 includes a plurality of second conducting lines 7480,a plurality of electrodes 7482 arranged along the Y axis and a pluralityof insulating layers 7484 connecting the electrodes 7482. The firstpatterned sensing lines 744 and second patterned sensing lines 748intersect and are biaxially oriented. The plurality of electric bridges7444 cross over the plurality of insulating layers 7484 to connect theplurality of adjacent electrodes 7442 therebetween. The first patternedsensing lines 744 and the second patterned sensing lines 748 areelectrically insulated from each other. The electrode shape of shown byFIG. 8A is a rhombus, without limitation thereto. The electrode shapemay be square, rectangle, regular hexagon, or an irregular pattern withrandomized arrangement.

As shown in FIGS. 7A and 7B, the first patterned sensing lines 744 andthe second patterned sensing lines 748 are positioned under the adhesivebearing layer 742. The adhesive bearing layer 742 is used as a bearingsubstrate of the first patterned sensing lines 744 and the secondpatterned sensing lines 748. Further, the adhesive bearing layer 742adheres the first patterned sensing lines 744 and the second patternedsensing lines 748 to the cover plate 720. Because the adhesive bearinglayer 742 does not need to cover the difference in etching step heightof the first patterned sensing lines 744 and the second patternedsensing lines 748, thickness of the adhesive bearing layer 742 rangesfrom 25 μm to 30 μm.

Referring to FIG. 7B, a method for fabricating the touch panel 740 isnow described. The method includes at least the following steps. Anadhesive bearing layer 742 is provided. A conducting layer is coatedunder the adhesive bearing layer 742. The conducting layer is etched toform the first patterned sensing lines 744 and the second patternedsensing lines 748. The first patterned sensing lines 744 and the secondpatterned sensing lines 748 are electrically insulated from andintersected with each other in a same layer. A cover plate 720 isprovided and the first patterned sensing lines 744 and the secondpatterned sensing lines 748 are adhered to the cover plate 720 by theadhesive bearing layer 742. Please refer to the schematic diagrams offabrication method and the cross-section views for coating conductinglayer over the adhesive bearing layer as shown in FIG. 2A to FIG. 3B fordescription of the steps of coating these conducting layers.

FIG. 9A shows a touch device 900 according to some embodiments of theinstant disclosure. FIG. 9B shows a schematic diagram of a touch panel940 of FIG. 9A. The touch device 900 includes the touch panel 940, anadhesive layer 950, and a display panel 960. The touch panel 940includes a cover plate 920, an adhesive bearing layer 942, and aplurality of patterned sensing lines 946. The patterned sensing lines946 are directly formed on the adhesive bearing layer 942 such that alower surface of the patterned sensing lines 946 are in direct contactwith the adhesive bearing layer 942. The patterned sensing lines 946 andthe adhesive bearing layer 942 form an adhesive component. The adhesivelayer 950 is between the touch panel 940 and the display panel 960 toadhere the touch panel 940 to the display panel 960. A thickness of theadhesive layer 950 ranges from 15 μm to 20 μm. According to someembodiments of the instant disclosure, the adhesive bearing layer 942may directly adhere to the display panel 960.

According to some embodiments of the instant disclosure, the patternedsensing lines 946 include a plurality of first patterned sensing lines944 and a plurality of second patterned sensing lines 948. The firstpatterned sensing lines 944 and the second patterned sensing lines 948intersect in a same layer and are electrically insulated from eachother. Please refer to description of the first patterned sensing lines744 and the second patterned sensing lines 748 as shown in FIG. 8 fordetails of the first patterned sensing lines 944 and the secondpatterned sensing lines 948.

As shown in FIGS. 9A and 9B, the first patterned sensing lines 944 andthe second patterned sensing lines 948 are positioned over the adhesivebearing layer 942. The adhesive bearing layer 942 is used as a bearingsubstrate of the first patterned sensing lines 944 and the secondpatterned sensing lines 948. Further, the adhesive bearing layer 942adheres the first patterned sensing lines 944 and the second patternedsensing lines 948 to the cover plate 920. In order to fully cover thefirst patterned sensing lines 944 and the second patterned sensing lines948 and overcome a difference in etching step height of the firstpatterned sensing lines 944 and the second patterned sensing lines 948,a thickness of the adhesive layer 942 increases accordingly. A thicknessof the adhesive bearing layer 942 ranges from 40 μm to 60 μm.

Further, it is worth noting that although FIG. 9A shows the area of theadhesive bearing layer 942 as being the same as the area of thepatterned sensing lines 946, the area of the adhesive bearing layer 942is generally larger than the area of the patterned sensing lines 946 inactual fabrication. More specifically, the patterned sensing lines 946are practically positioned at a central region (corresponding to avisual region of touch panel 940) of the adhesive bearing layer 942. Aperipheral region (corresponding to a non-visible region of touch panel940) of the adhesive bearing layer 942 still remains a certain area toadhere the patterned sensing lines 946 to the cover plate 920.

As shown in FIG. 9B, a method for fabricating the touch panel 940 isprovided. The method includes at least the following steps. An adhesivebearing layer 942 is provided. A conducting layer is coated over theadhesive bearing layer 942. The conducting layer is etched to form thefirst patterned sensing lines 944 and the second patterned sensing lines948. The first patterned sensing lines 944 and the second patternedsensing lines 948 are electrically insulated from and intersecting witheach other in a same layer. A cover plate 920 is provided and the firstpatterned sensing lines 944 and the second patterned sensing lines 948are adhered to the cover plate 920 by the adhesive bearing layer 942.Please refer to description of the schematic diagrams of fabricationmethod and the cross-section views for coating conducting layer over theadhesive bearing layer as shown in FIG. 2A to FIG. 3B for description ofthe step of coating these conducting layers.

The etching method and the material of cover plate and adhesive bearinglayer of embodiments shown in FIGS. 2-9B refer to the embodiment of FIG.1 shown.

From the above embodiments of instant disclosure, the disclosure has thefollowing advantages. In touch panel, the patterned sensing lines aredirectly formed on the adhesive bearing layer rather than a bearingsubstrate. Therefore, the steps in process of fabricating touch panelare simplified. The number of adhesion process steps is reduced and theproduction yield is promoted as well. The touch panel becomes thinnerand lighter. The cost is reduced and adaptability is extended.

Although the instant disclosure has been described in considerabledetail with reference to certain embodiments thereof, other embodimentsare possible. Therefore, the spirit and scope of the appended claimsshould not be limited to the description of the embodiments containedherein.

What is claimed is:
 1. A method of fabricating a touch panel,comprising: providing a cover plate; adhering a first adhesive componentunderneath the cover plate, comprising: removing a first release filmfrom a first adhesive bearing layer to expose a first sticky surface ofthe first adhesive bearing layer; coating a first conducting layer onthe first sticky surface of the first adhesive bearing layer; andpatterning the first conducting layer to form a plurality of firstpatterned sensing lines, wherein the patterning the first conductinglayer comprises etching the first conducting layer; and directlyadhering a second adhesive component to the first adhesive component,comprising: coating a second conducting layer on a second adhesivebearing layer; and patterning the second conducting layer to form aplurality of second patterned sensing lines, wherein: the patterning thesecond conducting layer comprises etching the second conducting layer,and the plurality of first patterned sensing lines are electricallyinsulated from the plurality of second patterned sensing lines.
 2. Themethod of claim 1, wherein the directly adhering the second adhesivecomponent to the first adhesive component comprises: using the secondadhesive bearing layer to adhere the plurality of second patternedsensing lines to the first adhesive component.
 3. The method of claim 1,wherein: the adhering the first adhesive component underneath the coverplate comprises removing a second release film from the first adhesivebearing layer to expose a second sticky surface of the first adhesivebearing layer, the directly adhering the second adhesive component tothe first adhesive component comprises removing a third release filmfrom the second adhesive bearing layer to expose a first sticky surfaceof the second adhesive bearing layer, and the coating the secondconducting layer comprises coating the second conducting layer on thefirst sticky surface of the second adhesive bearing layer.
 4. The methodof claim 3, wherein: the directly adhering the second adhesive componentto the first adhesive component comprises directly adhering the firststicky surface of the second adhesive bearing layer to the second stickysurface of the first adhesive bearing layer, and the adhering the firstadhesive component underneath the cover plate comprises directlyadhering the first sticky surface of the first adhesive bearing layer tothe cover plate.
 5. The method of claim 1, wherein: the adhering thefirst adhesive component underneath the cover plate comprises removing asecond release film from the first adhesive bearing layer to expose asecond sticky surface of the first adhesive bearing layer, the directlyadhering the second adhesive component to the first adhesive componentcomprises removing a third release film from the second adhesive bearinglayer to expose a first sticky surface of the second adhesive bearinglayer and removing a fourth release film from the second adhesivebearing layer to expose a second sticky surface of the second adhesivebearing layer, and the coating the second conducting layer comprisescoating the second conducting layer on the second sticky surface of thesecond adhesive bearing layer.
 6. The method of claim 5, wherein: thedirectly adhering the second adhesive component to the first adhesivecomponent comprises directly adhering the first sticky surface of thesecond adhesive bearing layer to the first sticky surface of the firstadhesive bearing layer.
 7. The method of claim 5, wherein: the directlyadhering the second adhesive component to the first adhesive componentcomprises directly adhering the first sticky surface of the secondadhesive bearing layer to the second sticky surface of the firstadhesive bearing layer, and the adhering the first adhesive componentunderneath the cover plate comprises directly adhering the first stickysurface of the first adhesive bearing layer to the cover plate.
 8. Themethod of claim 1, wherein the etching the first conducting layercomprises performing at least one of laser etching, chemical etching,plasma etching, or photolithography.
 9. The method of claim 1, whereinthe etching the second conducting layer comprises performing at leastone of laser etching, chemical etching, plasma etching, orphotolithography.
 10. The method of claim 1, wherein the adhering thefirst adhesive component underneath the cover plate comprises: removinga second release film from the first adhesive bearing layer to expose asecond sticky surface of the first adhesive bearing layer, and adheringthe second sticky surface of the first adhesive bearing layer to thecover plate after the patterning the first conducting layer.
 11. Themethod of claim 1, wherein the adhering the first adhesive componentunderneath the cover plate comprises: adhering the first sticky surfaceof the first adhesive bearing layer to the cover plate after thepatterning the first conducting layer.
 12. The method of claim 1,wherein the first conducting layer comprises silver nanowires.
 13. Themethod of claim 1, wherein: the directly adhering the second adhesivecomponent to the first adhesive component comprises removing a secondrelease film from the second adhesive bearing layer to expose a firststicky surface of the second adhesive bearing layer, and the coating thesecond conducting layer comprises coating the second conducting layer onthe first sticky surface of the second adhesive bearing layer.
 14. Themethod of claim 13, wherein the directly adhering the second adhesivecomponent to the first adhesive component comprises: removing a thirdrelease film from the second adhesive bearing layer to expose a secondsticky surface of the second adhesive bearing layer, and adhering thesecond sticky surface of the second adhesive bearing layer to the firstadhesive component after the patterning the second conducting layer. 15.The method of claim 13, wherein the directly adhering the secondadhesive component to the first adhesive component comprises: adheringthe first sticky surface of the second adhesive bearing layer to thefirst adhesive component after the patterning the second conductinglayer.
 16. A method of fabricating a touch panel, comprising: providinga cover plate; adhering a first adhesive component underneath the coverplate, comprising: coating a first conducting layer on a first adhesivebearing layer; and patterning the first conducting layer to form aplurality of first patterned sensing lines, wherein: the patterning thefirst conducting layer comprises etching the first conducting layer, andthe plurality of first patterned sensing lines and the first adhesivebearing layer together define the first adhesive component; coating asecond conducting layer on a second adhesive bearing layer; patterningthe second conducting layer to form a plurality of second patternedsensing lines, wherein: the patterning the second conducting layercomprises etching the second conducting layer, and the plurality ofsecond patterned sensing lines and the second adhesive bearing layertogether define a second adhesive component; and directly adhering thesecond adhesive component to the first adhesive component after thepatterning the second conducting layer.
 17. The method of claim 16,comprising: removing a release film from the second adhesive bearinglayer to expose a first sticky surface of the second adhesive bearinglayer, wherein the directly adhering the second adhesive component tothe first adhesive component comprises adhering the first sticky surfaceof the second adhesive bearing layer to the first adhesive component.18. The method of claim 17, wherein the coating the second conductinglayer comprises coating the second conducting layer on the first stickysurface.
 19. A method of fabricating a touch panel, comprising:providing a cover plate; adhering a first adhesive component underneaththe cover plate, comprising: coating a first conducting layer on a firstadhesive bearing layer; and patterning the first conducting layer toform a plurality of first patterned sensing lines, wherein thepatterning the first conducting layer comprises etching the firstconducting layer; and directly adhering a second adhesive component tothe first adhesive component, comprising: removing a first release filmfrom a second adhesive bearing layer to expose a first sticky surface ofthe second adhesive bearing layer; coating a second conducting layer onthe first sticky surface of the second adhesive bearing layer; andpatterning the second conducting layer to form a plurality of secondpatterned sensing lines, wherein: the patterning the second conductinglayer comprises etching the second conducting layer, and the pluralityof first patterned sensing lines are electrically insulated from theplurality of second patterned sensing lines.
 20. The method of claim 19,wherein the directly adhering the second adhesive component to the firstadhesive component comprises adhering the first sticky surface of thesecond adhesive bearing layer to the first adhesive component.